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一．TFT 工艺流程中英文标准名称Array Process Flow
阵列段工艺流程
Unpacking 拆包装Initial clean 预备清洗Input 投料
Particle count 尘埃粒子测试Clean before depo
成膜前清洗Gate （Mo/Al alloy ) Film depo 栅电极成膜RS meter 电阻测量Macro Inspection 宏观检查Clean before PR 涂胶前清洗Pre bake 预烘PR Coating 光刻胶涂布PR vacuum dry(VCD)光刻胶低压干燥PR soft bake 前烘Expose
曝光
Titler Expose/Edge Expose
打标/边缘曝光Develop 显影PR hard bake 坚膜
ADI
显影后自动光学检查Mic/Mac Inspection 宏微观检查CD after develop 显影后关键尺寸检查Total pitch 长寸测量Gate Wet etch 栅电极湿刻Contact angle 接触角测量PR strip 光刻胶剥离CD after etch 刻蚀后关键尺寸测量AEI
刻蚀后自动光学检查Micro/Macro Inspection 宏微观检查Gate 栅电极层
Laser Repair 激光修补Clean before depo 成膜前清洗Active film depo Active 成膜AOI
自动光学检查Macro Inspection 宏观检查Thickness Measurement 厚度测量Clean before PR 涂胶前清洗Active 层
Pre bake
预烘
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PR Coating 光刻胶涂布PR vacuum dry 光刻胶低压干燥PR soft bake 前烘Expose 曝光Develop 显影PR hard bake 坚膜
ADI
显影后自动光学检查Mic/Mac Inspection
宏微观检查
Active film Dry etch & Ashing Active 膜干刻与灰化Thickness Measurement 厚度测量PR strip 光刻胶剥离AEI
刻蚀后自动光学检查Mic/Macro Inspection 宏微观检查Clean before depo 成膜前清洗S/D Mo film depo 源/漏电极成膜RS meter 电阻测量MACRO Inspection 宏观检查Clean before PR 涂胶前清洗Pre bake 预烘PR Coating 光刻胶涂布PR vacuum dry 光刻胶低压干燥PR soft bake 前烘Expose 曝光Edge expose 边缘曝光Develop 显影PR hard bake 坚膜
ADI
显影后自动光学检查MIC/MAC Inspection 宏微观检查CD after develop 显影后关键尺寸检查Hard bake by oven 烘炉坚膜
S/D Mo Wet etch 源电极/漏电极湿刻n+ a-Si Dry etch n+高掺杂膜干刻PR strip
光刻胶剥离Thickness Measurement 厚度测量
CD after etch 刻蚀后关键尺寸测量AEI
刻蚀后自动光学检查Micro/Macro Inspection 宏微观检查
Clean before O/S test 短路/开路测试前清洗S/D
源/漏电极层
Open/Short Test
短路/开路测试
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Clean before depo 成膜前清洗Pass'n film depo 保护膜成膜AOI
自动光学检查MACRO Inspection 宏观检查Thickness Measurement 厚度测量Clean before PR 涂胶前清洗Pre bake 预烘PR Coating 光刻胶涂布PR vacuum dry 光刻胶低压干燥PR soft bake
前烘Expose 曝光Edge expose 边缘曝光Develop 显影PR hard bake 坚膜
ADI
显影后自动光学检查Micro/Macro Inspection 宏微观检查SinX Dry etch & ASHING 氮化硅干刻与灰化PR strip 光刻胶剥离AEI
刻蚀后自动光学检查Passivation 保护层
Micro/Macro Inspection 宏微观检查Clean before PR 成膜前清洗a-ITO film depo ITO 成膜RS meter 电阻测试Anneal
煺火Macro Inspection 宏观检查Clean before PR 涂胶前清洗Pre bake 预烘PR Coating 光刻胶涂布PR vacuum dry 光刻胶低压干燥PR soft bake 前烘Expose 曝光Develop 显影PR hard bake 坚膜
ADI
显影后自动光学检查Micro/Macro Inspection 宏微观检查ITO film etch ITO 膜湿刻PR strip 光刻胶剥离AEI
刻蚀后自动光学检查ITO ITO 层
Micro/Macro Inspection
宏微观检查
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Anneal
煺火Array test 阵列测试Array repair 阵列修补TEG test TEG 测试Final E/T 最终电测
Sort
分级
Cell Process flow
制盒段工艺流程
CF Initial Clean
彩膜预备清洗CF AOI 彩膜自动光学检查
CF Input 彩膜投料
CF Sort 彩膜分级Clean before PI
配向膜涂布前清洗PI Print 配向膜涂布Pre-cure 预固化PI Inspection 配向膜检查PI Thickness Measurement 配向膜厚度测量
Main-cure 固化PI 配向膜
PI rework 配向膜返工CF&TFT Matching
CF&TFT 匹配Rubbing 配向摩擦Rubbing Inspection 摩擦检查Loader & Un loader
上料机/下料机
Buffer 缓冲器CST Buffer 工装栏缓冲器Rotation/Cooling Unit 旋转/冷却单元Turn Align Unit 旋转/对位单元Turn Over Unit 翻转单元After Rubbing Cleaner
摩擦后清洗Spacer Spray 衬垫球散布Spacer Counter 衬垫球计数Spacer rework 衬垫球返工Spacer Cure 衬垫球附着固化Short Dispense 导电胶涂布Sealant Dispense 边框胶涂布Seal Inspection 边框胶检查LC Dispense 液晶滴下Vacuum Assembly
真空贴合UV Cure 紫外线固化Mis-alignment check
错位检查ODF
array工艺详解Seal Oven
边框胶热固化
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Eye Inspection 目视检查Cell gap Measurement 盒厚测试1/4(1/6)Sheet Cutting,
1/4(1/6)切割
Stick Cutting，切条Cell Cutting 切粒Cutting 切割
Visual Test Visual 测试
Edge Grind 磨边Dipping clean 浸泡式清洗Clean before Pol
贴片前清洗Pol Attach 贴片Pol Inspection 贴片检查ECP
Pol rework
贴片返工Auto Clave Auto Clave 消泡Laser
Laser Trimmer 激光切线Gross Test 终检Repair 修补Bin sorter 分级OQC Test 出货检查Test 测试
Store
货栈
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